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THERLICON TPO‑500 Pressure Oven

THERLICON TPO‑500 pressure oven max working pressure 8 kgf/cm², temp range 25‑200°C, for epoxy encapsulation degassing, void elimination of power semiconductor components.

THERLICON TPO‑500 Pressure Oven is high‑pressure thermal processing equipment for semiconductor epoxy encapsulation, adhesive curing and degassing processes. By applying uniform positive pressure inside sealed chamber during heating, it effectively suppresses bubble generation inside epoxy resin, minimizing voids within encapsulation layers and improving long‑term reliability for power semiconductor devices. It adopts double‑layer horizontal circular SUS304 pressure vessel. Working temperature range 25‑200℃, typical process temperature 60‑150℃. Max working pressure reaches 8 kgf/cm², pressure control accuracy ±0.1 kgf/cm², temperature uniformity ±1.5℃. Internal usable chamber dimension 500×500×225 mm (double‑layer configuration; optional four‑layer 500×500×100 mm). Overall machine dimension 1415×2100×1825 mm. Equipped with water‑cooled rapid cooling system; no‑load heating rate 3‑5℃/min. Chamber and gas pipelines adopt full SUS304 material with built‑in HEPA filter to maintain clean process environment. It supports nitrogen purging for adjustable oxygen‑level control inside chamber. It is widely used for power module epoxy potting, sensor encapsulation and automotive electronic component curing‑degassing applications.

Core Features

  • Double‑layer horizontal circular pressure chamber, all wetted parts SUS304 stainless‑steel

  • Max working pressure up to 8 kgf/cm², pressure stability ±0.1 kgf/cm²

  • Working temperature:25‑200°C, temperature uniformity ±1.5°C

  • Inner chamber size:500×500×225 mm (2‑layers); optional 4‑layers 500×500×100 mm

  • Water‑cooled rapid‑cooling design, no‑load heating rate:3‑5°C/min

  • Built‑in HEPA filtration inside chamber for clean‑grade processing

  • Programmable nitrogen purging to regulate internal oxygen concentration

  • 22‑inch industrial PC HMI, PID closed‑loop control for pressure & temperature

  • Recipe storage, real‑time production‑data logging & export function

  • Multi‑level safety interlock: over‑pressure, over‑temperature and door‑lock protection, meets national safety‑certification standard思立康

Specs (Summary)

Item Parameter
Model TPO‑500
Chamber Structure Double‑layer horizontal circular pressure vessel
Chamber Material SUS304 stainless steel
Inner Chamber Dimension 500×500×225 mm (2‑layers); optional 4‑layers 500×500×100 mm
Overall Machine Dimension 1415 × 2100 × 1825 mm
Working Temperature Range 25‑200℃(Typical 60‑150℃)
Temperature Uniformity ±1.5℃
Max Working Pressure 8 kgf/cm²
Pressure Control Precision ±0.1 kgf/cm²
Heating Rate (No‑load) 3‑5℃/min
Cooling Method Water‑cooled rapid cooling system
Atmosphere Nitrogen purge optional, controllable oxygen content
Control Unit 22‑inch industrial PC, recipe & data logging
Application Semiconductor epoxy encapsulation, degassing, adhesive curing