CTW MEKA DIP AOI B2 Before-Wave / B2 Go After-Wave

CTW MEKA B2 inline DIP AOI is specially developed for THT through-hole assembly production lines. The B2 Before-Wave is deployed before wave soldering, checking inserted components, pin bending, missing parts and reversed polarity before boards enter the wave solder oven. B2 Go After-Wave inspects PCBs after wave soldering to catch solder bridges, insufficient solder, pin holes and soldering defects.

Both models adopt large FOV camera system with planar + 4-side angle lighting, supporting PCB panel up to 1000mm length. Built-in AI programming reduces setup time, ideal for electronics manufacturers with mixed DIP batch production.

Core Advantages

1. Dedicated for THT DIP Wave Soldering ProcessTwo versions to fit pre-wave and post-wave inspection stages, cover full through-hole assembly quality control.

2. Large Field of View & Long PCB SupportSupports PCB length up to 1000mm, compatible with panelized DIP boards. 20MP /25MP /65MP optional high resolution camera.

3. AI One-Click ProgrammingAI component library speeds up new program creation, reduces engineer programming workload. Multi-angle lighting handles tall through-hole components.

4. Rigid Mechanical Frame & SMEMA CompatibilityStable inline conveyor, standard SMEMA interface to connect with wave solder machine and other DIP line equipment. SPC quality data report function.

Model Comparison Table

Key Specifications

Machine Details

• Multi-angle segmented LED lighting system (plane + four side lights)

• Large FOV high resolution industrial camera

• Anti-vibration rigid machine frame

• Inline automatic PCB conveyor for long DIP panels

• Industrial touch screen HMI, AI fast programming

• Built-in SPC quality statistical module

• SMEMA compatible with DIP wave soldering production line