CTW MEKA 3D AOI M3 / M3 Pro / M3 Pro Max / M3 Ultra

CTW MEKA M3 series inline 3D AOI is designed for high-precision PCBA solder joint and component inspection after SMT reflow. Equipped with high-speed 3D structured light projection and multi-angle 2D color imaging, it can measure solder height, volume and component coplanarity objectively, which cannot be achieved by traditional 2D AOI.

M3 is the standard base model; M3 Pro upgrades camera resolution and inspection speed; M3 Pro Max supports larger PCB panel size; M3 Ultra is the top-tier version with higher 3D sampling precision for automotive and medical electronics. All models share the same powerful inspection software and stable rigid mechanical frame.

Core Advantages

1. 3D Structured Light MeasurementCaptures real 3D geometry of solder joints, measure height and volume quantitatively, greatly lower false call rate compared with 2D AOI.

2. 4 Models for Different Production RequirementsM3 for general SMT lines; M3 Pro for high-volume manufacturing; M3 Pro Max for large PCBA panels; M3 Ultra for high-reliability industries.

3. Intelligent Inspection SoftwareSupports Gerber import, one-click programming, rich defect library, SPC statistical analysis and production data export.

4. Rigid Machine Frame & SMEMA ReadyAnti-vibration structure for long-time stable running. Standard SMEMA interface to connect seamlessly with upstream and downstream SMT equipment.

Model Comparison Table

Key Specifications

Machine Details

• 3D structured light projector + multi-angle color camera array

• High precision linear motion module, anti-vibration rigid frame

• Inline automatic PCB conveyor

• Industrial touch screen HMI, simple operation

• Built-in quality SPC statistics system

• SMEMA compatible with full SMT assembly line