JT VLO / JTL-730 Vacuum Reflow Oven

JT VLO / JTL-730 vertical curing oven is inline continuous thermal processing equipment designed for PCBA adhesive curing, conformal coating baking and underfill curing. Different from traditional horizontal ovens which occupy large floor space, this vertical stacked tunnel structure saves over 40% workshop area. The machine uses PID closed-loop temperature control system, working temperature range from room temperature up to 180°C, temperature uniformity within ±1°C. The conveyor supports PCB width from 50mm to 460mm, transport speed adjustable 0.2–2.0 m/min. It has multi independent heating zones, each zone can set separate temperature curve to match different curing requirements. Hot air circulating design ensures stable heat distribution across the whole PCB surface, avoiding local overheating or insufficient curing. It can connect directly after coating dispensing or conformal coating station, realizing fully automatic inline production. Widely used in automotive electronics, power modules and sensor PCBA manufacturing.

Core Features

• Vertical stacked tunnel design, saves 40% factory floor space compared with horizontal oven

• PID closed-loop temperature control, temp range RT ~180°C, temperature uniformity ±1°C

• PCB width: 50–460 mm, adjustable conveyor speed: 0.2–2.0 m/min

• Multiple independent heating zones, customizable temperature profile for different glue types

• Forced hot air circulation, consistent heating across PCBA surface

• Continuous inline operation, seamless connection with upstream coating / dispensing process

• Touch screen HMI, recipe storage, production data logging and export

• Over-temperature alarm and automatic power-off protection

Specs (Summary)