THERLICON TVR-400 Vacuum Reflow Oven

THERLICON TVR-400 Vacuum Reflow Oven is a high-end thermal processing system designed for semiconductor packaging and power electronics assembly. Traditional reflow soldering tends to generate voids inside solder joints, which degrade thermal conductivity and long-term reliability of power modules. Soldering under low vacuum environment can effectively remove gas bubbles and reduce solder void rate below 1%. The machine adopts hybrid infrared and hot plate heating system. Its working temperature ranges from room temperature up to 450°C, with temperature uniformity within ±2°C on the heating plate. The vacuum chamber achieves 5 mbar ultimate vacuum, and supports fully programmable vacuum ramp-up, dwell and release profiles. The chamber accommodates substrates up to 320 × 320 mm. Nitrogen purge function is optional to prevent oxidation during high-temperature soldering. It supports multi-step temperature and vacuum recipe storage, widely applied for IGBT, SiC power modules, MOSFET, LED and hermetic component packaging.

Core Features

• Ultimate vacuum down to 5 mbar, solder void ratio <1% for high power packages

• Hybrid IR & hot plate heating, working temperature RT ~ 450°C, temperature uniformity ±2°C

• Max substrate dimension: 320 × 320 mm

• Fully programmable temperature curve and vacuum profile

• Optional nitrogen purge to avoid oxidation during high-temperature soldering

• High precision pressure sensor, real-time chamber status monitoring

• Touch screen control system, recipe storage and production log export

• Multi safety interlock protection for over-temperature, over-pressure and gas leakage

Specs (Summary)