THERLICON TFV-400 Vacuum Formic Acid System

THERLICON TFV-400 vacuum formic acid system is an advanced flux-free soldering equipment for high-end semiconductor power packaging. It uses formic acid vapor to remove oxide layers on solder surfaces at low temperature, followed by vacuum soldering, eliminating the need for liquid flux and avoiding flux residue contamination. This inline machine adopts 3 independent vacuum chambers. The ultimate vacuum can reach ≤2 mbar. The maximum working temperature is 450°C with excellent temperature uniformity of ±2°C. The system precisely controls formic acid vapor concentration and gas flow. The maximum substrate dimension is 400 × 320 mm. The whole machine total power is 32kW. It can achieve solder void rate less than 1% after soldering. It is widely used for IGBT, SiC MOSFET, power diode, laser diode and high reliability aerospace electronic modules.

Core Features

• Formic acid vapor reduction technology, flux-free soldering, no residual contamination

• Three independent vacuum chambers, ultimate vacuum ≤2 mbar

• Max working temperature up to 450°C, temperature uniformity ±2°C

• Max substrate size: 400 × 320 mm

• Precise closed-loop control of formic acid concentration and gas flow

• Solder joint void rate controlled below 1%

• Inline continuous processing design, compatible with automatic loading & unloading

• Real-time monitoring of vacuum, temperature and gas concentration

• Touch screen HMI, multi-step recipe storage, production data logging

• Safety interlock for formic acid leakage, over-temperature and over-pressure protection

Specs (Summary)