VCTA SIP V850 / V860 3D Solder Paste Inspection Machine
VCTA SIP V850 & V860 inline 3D SPI adopt multi-frequency fringe projection technology. Two models available for standard and large PCB, delivering high-precision solder paste volume & height measurement for SMT production.
The VCTA SIP V850 and V860 are inline 3D SPI systems for solder paste quality control in modern SMT manufacturing. Using advanced multi-frequency fringe projection 3D optical technology, the machines reconstruct 3D profiles of solder paste deposits and accurately calculate volume, height, area and offset values.
The V850 is designed for standard PCB panels, while V860 supports larger PCB sizes. Both models share the same optical engine and software platform. The system effectively detects common printing defects including insufficient paste, excess paste, missing paste, bridging and displacement. With stable measurement repeatability, it is widely applied in consumer electronics, automotive electronics and high-density PCBA assembly.
Core Advantages
Multi-Frequency Fringe Projection 3D Technology
Multi-frequency fringe projection algorithm reduces measurement noise
Stable 3D profile reconstruction for different solder paste heights
Strong anti-interference ability for reflective PCB surfaces and solder mask
Dual Model Selection for Different PCB Sizes
V850 for standard-size PCBs, compact footprint saves factory floor space
V860 extended conveyor for larger circuit boards, suitable for server & industrial boards
High-Speed & High Precision Measurement
High-speed industrial camera array for fast full-panel scanning
Excellent repeatability on fine-pitch pad solder paste measurement
Balanced inspection speed and accuracy for mass production lines
Intelligent Defect Classification & SPC Analysis
Built-in AI-assisted defect classification to reduce false call rate
Complete SPC statistical function, data trend chart and report export
Supports MES system connection to realize intelligent factory process management
Stable Mechanical Structure
Reinforced machine frame to isolate workshop vibration
Reliable SMEMA interface for seamless connection with upstream and downstream SMT equipment
Multiple Model Options
| Model | Max PCB Size | Application Scenario |
|---|---|---|
| VCTA SIP V850 | 50 × 50 ~ 510 × 460 mm | Standard SMT production, consumer electronics, automotive PCB |
| VCTA SIP V860 | 50 × 50 ~ 610 × 510 mm | Larger PCB panels, industrial control boards, server motherboards |
Key Specifications
| Item | Parameter |
|---|---|
| Inspection Principle | Multi-frequency fringe projection 3D measurement |
| Inspection Items | Solder Paste Volume, Height, Area, X/Y Offset, Bridging, Shape Defects |
| Detectable Defects | Insufficient Paste, Excess Paste, Missing Paste, Paste Shift, Bridge, Smearing |
| Height Repeatability | ±1% |
| Minimum Pad | 0201 fine pad |
| Communication | SMEMA standard interface |
| Software Function | AI defect classification, SPC data analysis, report export, MES integration |
Machine Details
Multi-frequency fringe 3D optical inspection head
High-speed industrial camera group for parallel image acquisition
Reinforced anti-vibration machine frame
Automatic PCB transportation conveyor system
User-friendly touch screen operation interface
Built-in SPC statistical process control module
SMEMA interface compatible with full SMT assembly line
Optional MES system data docking function
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