MIRTEC MS-11 Series 3D Solder Paste Inspection Machine (3D SPI)

The MIRTEC MS-11 Series is a premium inline 3D SPI system designed for solder paste process control in SMT and semiconductor manufacturing. It evaluates solder paste printing quality by measuring solder paste height, area and volume, and supports real-time process feedback to upstream printing equipment.

Powered by shadow-free dual projection moiré phase shift imaging technology, the MS-11 eliminates shadow and reflection distortion during 3D measurement. Equipped with a 25MP high-resolution CoaXPress camera and telecentric lens system, it delivers stable, repeatable measurement results. The machine can inspect solder paste on ultra-fine 0201mm pads with a stencil height of 30μm, perfectly matching Mini-LED and high-density PCBA production requirements. The series includes MS-11 and MS-11U two models to accommodate different maximum PCB size demands.

Core Advantages

Shadow-Free Dual Projection Moiré Technology

• Dual opposite-direction projection removes shadow and reflection interference

• Accurate 3D solder profile measurement even for tall solder deposits

• Reliable measurement for high-density and fine-pitch PCB designs

Ultra High Precision Optical System

• 25MP high resolution CoaXPress high-speed camera

• Optional 4μm / 6μm precision telecentric lens, eliminates perspective distortion

• Large FOV design, reduces capture times and improves inspection throughput

Advanced PCB Warpage Compensation

• Automatically detects and compensates PCB bending and warpage

• Maintains accurate height measurement even on deformed circuit boards

Closed-Loop Smart Factory Solution

• Real-time data exchange with screen printers and pick & place machines

• Identify root causes of printing defects and optimize production process

• Built-in Intellisys® data analysis system for statistical process monitoring

Fine Feature Inspection Capability

• Supports solder paste inspection for 0201mm pad with 30μm stencil height

• Ideal for Mini-LED, semiconductor and high-end SMT assembly lines

Multiple Model Options

Key Specifications

Machine Details

• Shadow-free dual moiré projection 3D inspection head

• Telecentric optical system to avoid image perspective error

• Auto PCB warpage real-time compensation algorithm

• Closed-loop communication with SMT printer and mounter

• Intellisys® built-in statistical process control and defect trend analysis

• Optional SSF auto solder supply module for on-board solder paste repair

• Compatible with smart factory MES system integration