ES-E2
ESE ES‑E2 solder paste printer for SMT lines, max PCB 550×510mm, 10‑sec cycle time, alignment accuracy ±12.5μm@6‑sigma, great for mid‑volume PCB assembly.
ES‑E2 is the cost‑effective core model of E‑series automatic stencil printer, designed for medium‑volume SMT production. It adopts high‑rigidity machine frame and table structure, equipped with standard 3‑stage conveyor for high throughput. The vision system recognizes PCB and stencil marks simultaneously to guarantee precise alignment.
It supports PCB dimension from 50×50 mm up to 550×510 mm, PCB thickness 0.3‑6 mm. Optimized cycle time reaches 10 seconds. Alignment accuracy is ±12.5 μm @6‑sigma, printing repeatability ±25 μm @6‑sigma with Cpk≥2.0. E2+ version is available for higher repeatability of ±20 μm @6‑sigma.
Rich standard and optional features include wet/dry/vacuum stencil cleaning, squeegee auto‑calibration, 2D solder paste inspection, barcode traceability and MES data output. Suitable for consumer electronics, communication board and mixed‑batch manufacturing.
Key Features
Standard 3‑stage conveyor for high‑throughput inline production
Simultaneous mark recognition for PCB and stencil
Wet / Dry / Vacuum multi‑mode stencil cleaning system
Squeegee Z‑axis auto‑calibration
Support MES data collection and PCB barcode traceability
Main Specifications
Max PCB Size：550 mm × 510 mm
PCB Thickness：0.3 ~ 6 mm
Optimized Cycle Time：10 sec
Alignment Accuracy：±12.5 μm @ 6‑sigma
Printing Repeatability：±25 μm @ 6‑sigma (E2+: ±20 μm @6‑sigma), Cpk ≥2.0
Stencil Frame Size：550 / 584 / 650 / 736 mm
