VP-60L / VP-80L / VP-100L / VP-150L Series Vacuum Plasma Cleaning Machine
ANDA VP-60L/80L/100L/150L batch vacuum plasma series, multiple chamber volume options, for semiconductor, PCB packaging descum, micro residue removal and surface activation.
ANDA VP-60L/80L/100L/150L series are batch type vacuum plasma cleaning machines with four chamber volume selections. Under low vacuum condition, ionized plasma reacts with organic contaminants on workpiece surface, to realize micro residue removal, descum, surface activation and etching. This batch plasma series is widely used in semiconductor packaging, PCB/FPC, automotive electronics, plastic and metal material pretreatment. Users can select chamber volume according to workpiece size and batch capacity demand.
Key Features
| Item | VP-60L | VP-80L | VP-100L | VP-150L |
|---|---|---|---|---|
| Chamber Volume | 60L | 80L | 100L | 150L |
| Working Mode | Batch vacuum processing | Batch vacuum processing | Batch vacuum processing | Batch vacuum processing |
| Max Batch Loading | Custom fixture | Custom fixture | Custom fixture | Custom fixture |
| Plasma Power | 100~800W | 100~1000W | 100~1200W | 100~1500W |
| Frequency | 13.56 MHz | 13.56 MHz | 13.56 MHz | 13.56 MHz |
| Vacuum Pump | Dry pump | Dry pump | Dry pump | Dry pump |
| Process Gas | O₂, Ar, N₂, mixed gas | O₂, Ar, N₂, mixed gas | O₂, Ar, N₂, mixed gas | O₂, Ar, N₂, mixed gas |
| Power Supply | AC380V 6kVA | AC380V 7kVA | AC380V 8kVA | AC380V 10kVA |
| Dimension | 1400×1100×1680mm | 1500×1150×1700mm | 1600×1200×1750mm | 1750×1300×1800mm |
| Net Weight | 850kg | 960kg | 1100kg | 1300kg |
General Key Features for whole series
Multiple chamber volume options, flexible selection for different batch throughput
Uniform plasma distribution inside chamber, stable treatment effect for batch workpieces
Precision mass flow controller for gas, accurate gas ratio adjustment
Complete safety protection: over pressure, over temperature, gas leakage interlock
Simple operation with touch screen, up to 999 groups of process recipe storage
Main applications: IC packaging desmear, organic residue removal, surface activation before bonding & coating
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