VP-10S Automatic Vacuum Plasma Cleaning Machine (With Buffer Area)
ANDA VP-10S fully automatic vacuum plasma cleaner equipped with buffer waiting zone. It delivers high-uniformity plasma treatment for semiconductor packaging, PCBA and FPC, for descum, organic residue removal and surface activation.
ANDA VP-10S is a fully automatic vacuum plasma system with independent buffer waiting area. The waiting buffer zone realizes continuous loading and unloading without interrupting plasma processing, greatly improving production throughput. Under low-vacuum environment, high uniform plasma removes micro organic contamination, descum and activates material surface. Widely applied in advanced IC packaging, FPC, high-reliability PCBA and medical electronic components. It supports automatic transfer between buffer chamber and processing chamber, stable batch processing for high-end precision manufacturing.
Key Features
Built-in waiting buffer area, continuous feeding & discharging without stopping production
Fully automatic transfer system, no manual intervention
High uniformity vacuum plasma, gentle treatment for ultra-fine sensitive substrates
Independent gas mixing & precision gas flow control system
Real-time vacuum pressure, power and process monitoring with alarm protection
SMEMA compatible, easy integration with upstream and downstream production lines
Multiple process gas options: O₂, Ar, CF₄, N₂ and mixed gas recipes
Specifications
| Item | Parameter |
|---|---|
| Model | VP-10S |
| Working Condition | Vacuum environment |
| Chamber Structure | Process chamber + independent buffer waiting zone |
| Max Workpiece Size | 400 × 400 mm |
| Workpiece Thickness | 0.2 ~ 6 mm |
| Vacuum Pump | Dry vacuum pump |
| Plasma Power | 100 ~ 1000 W adjustable |
| Frequency | 13.56 MHz |
| Processing Cycle | Customizable based on process recipe |
| Control System | Industrial PC, recipe storage, production data export |
| Power Supply | AC380V, 50/60Hz, 8kVA |
| Machine Dimension | 1780 ×1420 ×1850 mm |
| Net Weight | Approx. 1350 kg |
| Application | IC packaging, FPC, high-end PCBA, medical electronics, descum & surface activation |
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