AP-460 Atmospheric Plasma System
ANDA AP-460 Atmospheric Plasma System delivers efficient surface activation, cleaning and etching for PCB, semiconductor and electronic components, improves adhesion without damaging delicate substrates.
The ANDA AP-460 Atmospheric Plasma System adopts normal-pressure plasma technology, no vacuum chamber required. It is widely used for surface activation, residue cleaning and glue removal of PCBA, semiconductor packages, plastic and metal parts. It effectively enhances surface wettability and coating adhesion, ideal for inline continuous production.
Key Features
Atmospheric plasma design, no vacuum pump, simple structure and low maintenance cost
Multi-nozzle optional, supports flexible inline integration into your production line
Gentle plasma treatment, avoids thermal damage to sensitive electronic substrates
Real-time monitoring of working status, stable and consistent treatment effect
Suitable for PCB, FPC, IC packaging, automotive electronics pretreatment before coating & bonding
Specifications
| Item | Parameter |
|---|---|
| Model | AP-460 |
| Working Environment | Atmospheric Pressure |
| Max Workpiece Width | 460 mm |
| Workpiece Thickness | 0.4 ~ 6 mm |
| Conveyor Speed | 0.2 ~12 m/min |
| Plasma Nozzle | Rotary / Straight Nozzle, up to 4 nozzles |
| Plasma Power | 150 ~1000 W adjustable |
| Positioning Accuracy | ±0.08 mm |
| Control System | Industrial PC, recipe management, production log export |
| Power Supply | AC380V, 50/60Hz, 6kVA |
| Gas Source | Compressed dry air / Nitrogen 0.4~0.7MPa |
| Machine Dimension | 1500 ×1100 ×1720 mm |
| Net Weight | Approx. 860 kg |
| Applicable Workpiece | PCBA, IC package, FPC, plastic & metal parts |
| Application | Surface cleaning, activation, etching, improve adhesion |
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