AP-3P Atmospheric Plasma System
ANDA AP-3P atmospheric plasma cleaning machine for PCBA and electronic packaging. It achieves surface activation and micro-residue removal at atmospheric pressure, improving bonding and coating adhesion without substrate damage.
ANDA AP-3P Atmospheric Plasma System is a normal-pressure plasma surface treatment equipment. It requires no vacuum chamber and supports offline or semi-automatic processing of workpieces. It is widely used for surface cleaning, activation and etching of PCBA, FPC, and small semiconductor packages. It effectively enhances surface wettability and significantly improves the adhesion of glue, coating and bonding layers. Compact footprint makes it suitable for small-batch production and laboratory verification.
Key Features
Atmospheric plasma technology, no vacuum pump, low operating & maintenance cost
Compact cabinet design, saves factory floor space
Precision plasma nozzle, uniform treatment for small electronic components
Gentle plasma output, prevents thermal damage to sensitive substrates
Simple operation with human-machine interface, easy recipe storage and recall
Main applications: pre-treatment for coating, dispensing and bonding
Specifications
| Item | Parameter |
|---|---|
| Model | AP-3P |
| Working Condition | Atmospheric Pressure |
| Processing Mode | Semi-automatic batch processing |
| Workpiece Size (Max) | 350 × 350 mm |
| Z-axis Height | 5~50 mm adjustable |
| Plasma Nozzle | Rotary nozzle, optional straight nozzle |
| Plasma Power | 100 ~ 800 W adjustable |
| Motion Speed | 10 ~ 500 mm/s |
| Positioning Accuracy | ±0.05 mm |
| Control System | Industrial PC + Windows OS, recipe storage up to 999 groups |
| Power Supply | AC220V, 50/60Hz, 3.5kVA |
| Gas Source | Compressed dry air / Nitrogen (0.4~0.7 MPa) |
| Machine Dimension | 900 × 950 × 1650 mm |
| Weight | Approx. 480 kg |
| Applicable Workpiece | PCBA, FPC, small IC packages, plastic parts |
| Function | Surface cleaning, activation, micro etching, adhesion improvement |
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