AP-8 Atmospheric Plasma System
ANDA AP-8 atmospheric plasma cleaning machine features high precision plasma control, ideal for high-end electronics, advanced packaging and FPC surface pretreatment before coating, bonding and dispensing.
ANDA AP-8 Atmospheric Plasma System is a high-precision inline atmospheric plasma equipment for high-end electronic manufacturing. It adopts upgraded plasma power and motion control system, delivering more uniform and controllable treatment effect for ultra-fine workpieces. It is commonly used for FPC, advanced semiconductor packaging, medical electronics and high-reliability automotive electronics to enhance surface adhesion and eliminate surface contaminants.
Key Features
High-precision motion platform, accurate positioning for selective plasma treatment
Adjustable plasma power and scanning speed to meet different material requirements
Inline automatic loading & unloading, fully automatic production
Closed-loop monitoring system to guarantee stable plasma energy output
Multiple safety interlocks for workshop safety operation
Suitable for high reliability products with strict surface treatment requirements
Specifications
| Item | Parameter |
|---|---|
| Model | AP-8 |
| Working Condition | Atmospheric Pressure |
| Processing Mode | Inline automatic selective scanning treatment |
| Max Workpiece Size | 500 × 500 mm |
| Workpiece Thickness | 0.3 ~ 8 mm |
| Plasma Nozzle | Rotary nozzle / straight micro nozzle optional |
| Plasma Power | 200 ~ 1500 W continuously adjustable |
| XY Motion Speed | 5 ~ 800 mm/s |
| Positioning Accuracy | ±0.03 mm |
| Repeatability | ±0.02 mm |
| Conveyor | Adjustable width conveyor, SMEMA compatible |
| Power Supply | AC380V, 50/60Hz, 9kVA |
| Gas | Dry air / Nitrogen / Mixed process gas |
| Machine Dimension | 1850 × 1400 × 1820 mm |
| Weight | Approx. 1200 kg |
| Applicable Workpiece | FPC, advanced IC package, medical electronics, high-end PCBA |
| Function | Micro-contamination removal, high-precision surface activation |
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