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Products

ANDA iPot Series Two-Component Automatic Potting Machine

ANDA iPot series two-component automatic potting machine integrates automatic metering, mixing and dispensing of AB glue. It is used for electronic parts encapsulation where no vacuum environment is required.

ANDA iPot series two-component automatic potting machine is a standalone AB glue automatic potting system. It can automatically complete material feeding, accurate ratio metering, dynamic mixing and path dispensing for two-component potting materials. This model is designed for normal pressure potting scenarios. It supports self-flowing and high-filler glues. The 3-axis motion platform can freely program potting trajectories with speed up to 500mm/s. The secondary valve structure eliminates glue dripping after dispensing. The anti-curing and automatic cleaning system reduces glue blockage and manual cleaning work. It can be used standalone or cooperate with the iPot material preparation machine for continuous glue supply. It is widely used for small and medium batch production of electronic components, power supplies and PCB modules.

Core Features

  1. Integrated automatic metering, ratio adjustment, dynamic mixing and dispensing for two-component AB glue

  2. Adapt to self-flowing glue and high-filler potting materials

  3. 3-axis servo motion platform, support point, line, circle, arc path programming, max speed 500 mm/s

  4. Secondary glue valve, no dripping and leakage

  5. Anti-curing structure and automatic cleaning function

  6. Optional multiple mixing valves to adjust cycle time

  7. Can cooperate with iPot material preparation machine for continuous glue supply

  8. Can be integrated into semi-automatic production line

Technical Specification

Item Parameter
Model iPot series Two-component Automatic Potting Machine
Working Condition Atmospheric pressure
Max Moving Speed 500 mm/s
Motion Platform 3-axis servo motion platform
Repeat Accuracy ±0.02 mm
Applicable Glue Two-component epoxy, polyurethane, high-filler compound
Working Environment Temp: 0~40℃, Humidity: 20~90%RH