ANDA iPot-ML4100 3-Stage Vacuum Potting Machine
ANDA iPot-ML4100 three-stage vacuum potting machine adopts continuous three-chamber vacuum design for high-volume bubble-free encapsulation. Suitable for mass production of new energy power modules and automotive electronics.
ANDA iPot-ML4100 three-stage vacuum potting machine is a continuous high-output vacuum encapsulation equipment. It is equipped with three independent vacuum chambers to realize loading, potting and unloading in parallel, which greatly improves production capacity compared with single-chamber vacuum potting equipment. The machine is compatible with self-flowing and high-filler two-component glue. It supports path programming with a maximum moving speed of 500mm/s. Multiple mixing valves can be configured to meet different cycle time requirements. The secondary valve structure ensures no dripping or glue leakage. Anti-curing and automatic cleaning functions reduce maintenance frequency. It can be connected with upstream and downstream automation equipment to form an automatic production line. It is widely used in mass production scenarios such as new energy power modules, automotive electronic control units and sensors.
Core Features
Three-chamber continuous vacuum design, realize parallel loading, potting and unloading, high throughput
Support self-flowing glue and high-filler potting materials
3-axis motion platform, editable path: point, line, circle and arc, max speed up to 500 mm/s
Multiple mixing valves optional to meet different CT requirements
Secondary glue valve, no dripping and no leakage
Built-in anti-curing and automatic cleaning function
Support docking with upstream and downstream equipment for automated mass production
Optional imported or domestic vacuum pump to maintain stable high vacuum environment
Technical Specification
| Item | Parameter |
|---|---|
| Model | iPot-ML4100 |
| Working Principle | 3-stage continuous vacuum chamber |
| Max Moving Speed | 500 mm/s |
| Motion Platform | 3-axis servo motion platform |
| Repeat Accuracy | ±0.02 mm |
| Applicable Glue | 2-component epoxy, PU, high-filler potting compound |
| Communication | SMEMA / Ethernet available for line connection |
| Working Environment | Temp: 0~40℃, Humidity: 20~90%RH |
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