ANDA iJet-S10 In-line Jet Dispenser
ANDA iJet-S10 non-contact inline jet dispensing system, engineered for high-precision underfill, dam & fill and encapsulation on advanced semiconductor substrates, IC modules and high-end PCBA.
ANDA iJet-S10 is a high-end in-line jet dispenser tailored for semiconductor packaging and high-density PCBA manufacturing. Built on ANDA mature jet dispensing platform, it adopts non-contact jet dispensing technology, eliminating needle contact with delicate substrates to avoid scratching, glue dragging and component displacement. Equipped with high-resolution dual CCD vision system and advanced motion control, iJet-S10 delivers ultra-precise glue dot positioning and consistent volume output. The inline conveyor supports automatic PCB/substrate loading, alignment, dispensing and unloading, capable of connecting to full automatic semiconductor and SMT production lines. It is widely deployed for IC module underfill, dam & fill, chip encapsulation and high-end board conformal coating.
Key Features
Non-contact jet dispensing, zero contact with fragile semiconductor substrates
Dual high-resolution CCD vision system for ultra-precise visual alignment
Inline automatic conveyor, seamlessly integrated into SMT & semiconductor production lines
Superior dispensing volume repeatability, stable performance for long-hour mass production
Compatible with various fluids: underfill, epoxy, encapsulant, conformal coating
Intelligent glue volume auto-calibration and jet valve cleaning function
Powerful recipe management, fast product switching and real-time production fault monitoring
Technical Specification
| Item | Parameter |
|---|---|
| Model | iJet-S10 |
| Dispensing Method | Non-contact Jet Dispensing |
| Positioning Accuracy | ±15μm |
| Dispensing Frequency | Up to 250Hz |
| Max PCB/Substrate Size | 510 × 510 mm |
| Conveyor | Inline automatic transport |
| Application | Semiconductor IC substrate, chip module underfill, high-density PCBA encapsulation |
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