ANDA iJet-7H In-line Jet Dispenser
ANDA iJet-7H high-speed in-line jet dispenser adopts non-contact jet dispensing technology. Ideal for SMT underfill, dam & fill, conformal coating and adhesive dispensing on PCBA and semiconductor substrates.
ANDA iJet-7H is a flagship in-line jet dispensing system built for high-volume SMT and semiconductor packaging production. It features non-contact jet dispensing, which eliminates needle contact with the workpiece, avoiding component scratching and glue dragging issues. The machine is designed for inline integration with SMT production lines. Automatic PCB loading, visual alignment, dispensing and unloading are completed continuously. It is widely applied for underfill, dam & fill, conformal coating, marking and encapsulation of chips, modules and PCBA boards. High-precision motion control and ANDA self-developed jet valve ensure stable glue volume consistency during long-time continuous mass production.
Key Features
Non-contact jet dispensing, no needle contact with PCB / substrate
High-precision visual alignment system, automatic position correction
Inline conveyor design, seamless connection with upstream and downstream SMT equipment
High repeatability dispensing volume, stable output for mass production
Supports various types of fluids: underfill, epoxy, silicone, conformal coating glue
Intuitive HMI operating system, convenient product recipe storage and quick switch
Real-time production monitoring, glue shortage and equipment fault alarm
Technical Specification
| Item | Parameter |
|---|---|
| Model | iJet-7H |
| Dispensing Method | Non-contact Jet Dispensing |
| Max PCB Size | 510 × 510 mm |
| Dispensing Frequency | Up to 200Hz |
| Positioning Accuracy | ±25μm |
| Conveyor | Inline automatic PCB transport |
| Application | SMT PCBA underfill, conformal coating, semiconductor module packaging |
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