JT AOI JTA-660B

JT AOI JTA-660B is a versatile inline Automated Optical Inspection platform compatible with both SMT and DIP assembly processes. It can be upgraded with optional 3D measurement module to deliver height measurement besides standard 2D visual checks, making it suitable for PCBA after wave soldering. The machine adopts high-performance image algorithm to detect DIP-related defects such as missing pins, bent leads, solder voids and bridging, as well as standard SMT component defects. The self-learning algorithm simplifies programming for new PCBA types. It supports large-size PCB and runs stably in high-mix electronics manufacturing. Inspection reports can be exported and integrated with MES for full process quality tracking.

Core Features

• Supports SMT and DIP post-wave soldering inspection

• Optional 3D measurement module for solder joint height analysis

• Powerful algorithm for DIP pin defect detection

• Auto-teach programming, fast product changeover

• Wide PCB size compatibility

• Data export and MES system connection available

Specs (Summary)

Inspection Type: 2D AOI, optional 3D module Application: SMT & DIP wave soldering inspection Min Component: 01005 PCB Thickness: 0.5 ~ 4.0 mm Conveyor: Adjustable width edge clamping conveyor