ES-H2
ESE ES‑H2 ultra-precision solder paste printer, ±8μm alignment accuracy, for ultra-fine pitch PCB and high reliability electronics manufacturing.
ES‑H2 is the top-tier model of ESE H-series, designed for ultra-fine pitch and high-reliability electronics manufacturing. It adopts ultra-rigid cast frame and upgraded high-resolution vision system. Alignment accuracy reaches ±8 μm @6‑sigma, printing repeatability ±15 μm @6‑sigma, Cpk≥2.0, perfectly handling 008004 chips, fine pitch BGA and QFN packages.
Max PCB dimension up to 700 × 610 mm, PCB thickness 0.3 ~ 6 mm. Optimized cycle time is 13 seconds. It supports auto stencil loading, intelligent squeegee pressure control, closed-loop printing force adjustment, advanced 2D paste inspection and full MES data integration.
This machine is preferred for automotive electronics, aerospace control modules, medical equipment and high-end server board production.
Key Features
Ultra-rigid cast frame structure to eliminate vibration
Upgraded high-resolution dual vision system
Ultra-fine pitch printing for 008004, BGA & QFN
Closed-loop squeegee pressure real-time adjustment
Auto stencil loading & full production data traceability
Main Specifications
Max PCB Size：700 mm × 610 mm
PCB Thickness：0.3 ~ 6 mm
Optimized Cycle Time：13 sec
Alignment Accuracy：±8 μm @ 6‑sigma
Printing Repeatability：±15 μm @ 6‑sigma, Cpk ≥2.0
Stencil Frame Size：650 / 736 / 800 / 850 / 900 mm
RELATED PRODUCTS
H Series
