ES-H1
ESE ES‑H1 automatic solder paste printer for fine pitch PCB. Alignment accuracy ±10μm@6-sigma, stable printing for automotive and medical electronic PCBA.
ES‑H1 is the entry high-precision model of H series, engineered for fine-pitch component printing applications. It uses a reinforced heavy-duty frame to reduce vibration during operation, paired with dual-camera high-speed vision alignment system to ensure precise registration between PCB and stencil.
Max PCB dimension reaches 600 × 510 mm, PCB thickness range 0.3 ~ 6 mm. Alignment accuracy up to ±10 μm @6‑sigma, printing repeatability ±20 μm @6‑sigma, Cpk≥2.0. Optimized cycle time is 11 seconds.
It supports wet/dry/vacuum stencil cleaning, squeegee pressure auto compensation, 2D post-print paste inspection, barcode tracking and MES connection. Widely deployed for automotive control boards, medical electronics and high-density consumer PCBA.
Key Features
Dual-camera high precision vision alignment system
Reinforced rigid machine frame for low vibration
Fine pitch printing capability for 01005 & QFN components
Multi-mode stencil cleaning: wet, dry, vacuum
Built-in interface for MES and production traceability
Main Specifications
Max PCB Size：600 mm × 510 mm
PCB Thickness：0.3 ~ 6 mm
Optimized Cycle Time：11 sec
Alignment Accuracy：±10 μm @ 6‑sigma
Printing Repeatability：±20 μm @ 6‑sigma, Cpk ≥2.0
Stencil Frame Size：550 / 584 / 650 / 736 mm
RELATED PRODUCTS
H Series
