ES-SPS

ES-SPS semi-automatic solder paste printer is a high-precision bench printing system designed for flip chip and advanced substrate prototyping & small batch production. It adopts Individual Align 2 Module, driven by high-resolution step motors to achieve independent X, Y and Theta alignment for each substrate.

Compared with conventional semi-automatic printers, ES-SPS delivers far superior alignment accuracy for flip chip packaging, flexible substrates and high-density micro assemblies. It supports manual stencil loading and easy program setup, which makes it ideal for R&D laboratories, prototype workshops and low-volume advanced electronics manufacturing.

The machine supports flexible substrate, thin PCB and ceramic substrate printing. It is widely used in semiconductor packaging, flip chip research, microelectronics and custom advanced PCBA development.

Key Features

• Individual Align 2 Module specially applied for Flip Chip applications

• High accurate & precise alignment driven by step motor system

• Independent X, Y, Theta alignment for each substrate

• Easy manual stencil loading and quick recipe change

• Suitable for thin PCB, ceramic substrate and flexible substrate printing

Main Specifications

• Alignment System：Individual Align 2 Module, step motor drive

• Supported Substrate：PCB, ceramic substrate, flexible substrate

• Application：Flip chip, microelectronics, prototype & small batch

• Operation Mode：Semi-automatic