ES-FA1
ESE FA1 solder paste printer with automatic stencil storage & change system, high precision printing for high mix low volume PCBA production.
FA1 is ESE flagship high-mix production printer developed for Industry 4.0 smart factory. Its core advantage is the built-in automatic stencil change system, which can hold up to 10 stencils and complete stencil switching fully automatically. Operators no longer need to stop the line and manually replace stencils during product changeover, drastically cutting down downtime.
It inherits the high-precision dual-camera vision alignment system from ESE H series. Alignment accuracy reaches ±10μm @6-sigma, printing repeatability ±20μm @6-sigma, Cpk≥2.0. Max PCB working size 600 × 510 mm.
Standard configurations include paperless stencil cleaning module, automatic solder paste dispenser, auto adjustable support pin system, 2D solder paste inspection and full MES data traceability. It is widely used for automotive electronics, medical devices and multi-model consumer electronics with frequent product change.
Key Features
Auto stencil storage & change system, support up to 10 stencils
Paperless stencil cleaning unit
Automatic solder paste feeding system
Auto configurable PCB support pins
Dual camera high precision vision alignment
Complete MES interface for smart factory
Main Specifications
Max PCB Size：600 × 510 mm
PCB Thickness：0.3 ~ 6 mm
Alignment Accuracy：±10 μm @6-sigma
Printing Repeatability：±20 μm @6-sigma, Cpk≥2.0
Stencil Storage Capacity：Up to 10 stencils
Stencil Frame Size：550 / 584 / 650 /736 mm
