ANDA TSV-200D / HSV-200D Benchtop Dispenser
ANDA TSV-200D and HSV-200D are compact benchtop dispensing systems, ideal for small batch PCBA, FPC and electronic component adhesive dispensing, potting and glue coating.
ANDA TSV-200D and HSV-200D are desktop 3-axis precision dispensers designed for small and medium batch production. The compact tabletop structure saves factory floor space, suitable for lab, prototype and low-volume manufacturing. TSV-200D is equipped with screw valve for high-volume, consistent dot dispensing. HSV-200D adopts high-speed jet valve for non-contact glue dispensing, to avoid dragging on fragile FPC and thin substrates. Both models come with CCD visual alignment system, supporting quick programming for various dispensing paths. They are widely used for component bonding, FPC reinforcement, LED encapsulation and small module potting.
Key Features
Compact benchtop design, easy installation and flexible workstation layout
Optional valve configuration: Screw valve (TSV-200D) / High-speed jet valve (HSV-200D)
CCD visual alignment system, automatic position correction for workpiece offset
Simple programming software, supports point, line, arc and irregular path drawing
Compatible with multiple glues: epoxy, UV glue, red glue, silicone, thermal conductive adhesive
Stable dispensing repeatability, good choice for prototype and small batch production
Simple maintenance, low operation threshold for operators
Technical Specification
| Item | TSV-200D | HSV-200D |
|---|---|---|
| Model | TSV-200D | HSV-200D |
| Dispensing Valve | Screw Valve | High Speed Jet Valve |
| Working Travel | 200 × 200 × 80 mm | 200 × 200 × 80 mm |
| Positioning Accuracy | ±0.02 mm | ±0.02 mm |
| Max Moving Speed | 500 mm/s | 500 mm/s |
| Work Method | Contact dispensing | Non-contact jet dispensing |
| Application | Small module potting, component bonding | FPC, thin substrate, micro dot dispensing |
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